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Document 32019L0172
RoHS exemption (15) for lead in solders to complete a viable electrical connection between semiconductor die and carrier
Delegovaná smernica Komisie (EÚ) 2019/172 zo 16. novembra 2018, ktorou sa na účely prispôsobenia vedeckému a technickému pokroku mení príloha III k smernici Európskeho parlamentu a Rady 2011/65/EÚ, pokiaľ ide o výnimku pre olovo v spájkach na zostavenie stabilného elektrického spojenia medzi polovodičovým čipom a nosičom v rámci súprav integrovaného obvodu Flip Chip (Text s významom pre EHP)
- Legal basis:
- 32011L0065 - A5P1PTA)
- EuroVoc thesaurus:
- environmentálna politika EÚ; povolenie na predaj; technologická zmena; elektronická súčiastka; zliatina; nebezpečná látka; olovo; marketingový štandard; vedecký pokrok; opracovanie kovov
- See the lifecycle of this act on the Interinstitutional register of delegated acts
-
- Documents:
- Ares(2018)884864 (Draft delegated directive)
- Legal basis:
- 32011L0065 - A5P1PTA)
- Leading service:
- Directorate-General for Environment
- Expert group:
- E02810
- Consultation type:
- Stakeholder feedback
- Consultation duration (weeks):
- 4
- Check the status of this initiative on the Better Regulation Portal
-
- Documents:
- C/2018/7499 final (Delegated directive)
- Leading service:
- Directorate-General for Environment
-
- Foreseen end of objection period:
- 16/01/2019
-
- Documents:
- 32019L0172 (Delegated directive)
- Date of publication:
- 05/02/2019