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Document 32019L0172
RoHS exemption (15) for lead in solders to complete a viable electrical connection between semiconductor die and carrier
Komisijas Deleģētā direktīva (ES) 2019/172 (2018. gada 16. novembris), ar ko, pielāgojot zinātnes un tehnikas attīstībai, Eiropas Parlamenta un Padomes Direktīvas 2011/65/ES III pielikumu groza attiecībā uz atbrīvojumu par svinu lodmetālos, ko izmanto stabilu elektrisko savienojumu izveidei starp pusvadītāja kristālu un nesēju apvērsto integrālshēmu (flip-chip) pakotnēs (Dokuments attiecas uz EEZ.)
- Legal basis:
- 32011L0065 - A5P1PTA)
- EuroVoc thesaurus:
- ES vides politika; tirgus atļauja; tehnoloģijas maiņa; elektroniskais komponents; sakausējums; bīstamā viela; svins; tirgdarbības standarts; zinātnes attīstība; metālapstrāde
- See the lifecycle of this act on the Interinstitutional register of delegated acts
-
- Documents:
- Ares(2018)884864 (Draft delegated directive)
- Legal basis:
- 32011L0065 - A5P1PTA)
- Leading service:
- Directorate-General for Environment
- Expert group:
- E02810
- Consultation type:
- Stakeholder feedback
- Consultation duration (weeks):
- 4
- Check the status of this initiative on the Better Regulation Portal
-
- Documents:
- C/2018/7499 final (Delegated directive)
- Leading service:
- Directorate-General for Environment
-
- Foreseen end of objection period:
- 16/01/2019
-
- Documents:
- 32019L0172 (Delegated directive)
- Date of publication:
- 05/02/2019