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Document 32019L0172
RoHS exemption (15) for lead in solders to complete a viable electrical connection between semiconductor die and carrier
Kommissionens delegerede direktiv (EU) 2019/172 af 16. november 2018 om tilpasning til den videnskabelige og tekniske udvikling af bilag III til Europa-Parlamentets og Rådets direktiv 2011/65/EU for så vidt angår en undtagelse for bly i loddemateriale til etablering af elektrisk forbindelse mellem halvlederskive og bæresubstrat i integrerede kredsløbspakker med flip chip (EØS-relevant tekst.)
- Legal basis:
- 32011L0065 - A5P1PTA)
- EuroVoc thesaurus:
- EU's miljøpolitik; salgstilladelse; teknologisk forandring; elektronisk komponent; legering; farligt stof; bly; handelsnorm; videnskabeligt fremskridt; metalarbejde
- See the lifecycle of this act on the Interinstitutional register of delegated acts
-
- Documents:
- Ares(2018)884864 (Draft delegated directive)
- Legal basis:
- 32011L0065 - A5P1PTA)
- Leading service:
- Directorate-General for Environment
- Expert group:
- E02810
- Consultation type:
- Stakeholder feedback
- Consultation duration (weeks):
- 4
- Check the status of this initiative on the Better Regulation Portal
-
- Documents:
- C/2018/7499 final (Delegated directive)
- Leading service:
- Directorate-General for Environment
-
- Foreseen end of objection period:
- 16/01/2019
-
- Documents:
- 32019L0172 (Delegated directive)
- Date of publication:
- 05/02/2019