Corrigendum to Commission Delegated Regulation (EU) 2022/1 of 20 October 2021 amending Regulation (EU) 2021/821 of the European Parliament and of the Council as regards the list of dual-use items

( Official Journal of the European Union L 3 of 6 January 2022 )

On page 142, in the Annex, point 3B001.f is replaced as follows:

‘f.

Lithography equipment as follows:

Align and expose step and repeat (direct step on wafer) or step and scan (scanner) equipment for wafer processing using photo-optical or X-ray methods and having any of the following:

a.	A light source wavelength shorter than 193 nm; or

b.	Capable of producing a pattern with a 'Minimum Resolvable Feature size' (MRF) of 45 nm or less; Technical Note: The 'Minimum Resolvable Feature size' (MRF) is calculated by the following formula: where the K factor = 0,35

Imprint lithography equipment capable of producing features of 45 nm or less;

Note:

3B001.f.2. includes:

—	Micro contact printing tools

—	Hot embossing tools

—	Nano-imprint lithography tools

—	Step and flash imprint lithography (S-FIL) tools

Equipment specially designed for mask making having all of the following:

a.	A deflected focussed electron beam, ion beam or "laser" beam; and

Having any of the following:

1.	A full-width half-maximum (FWHM) spot size smaller than 65 nm and an image placement less than 17 nm (mean + 3 sigma); or

Not used;

3.	A second-layer overlay error of less than 23 nm (mean + 3 sigma) on the mask;

Equipment designed for device processing using direct writing methods, having all of the following:

a.	A deflected focused electron beam; and

Having any of the following:

1.	A minimum beam size equal to or smaller than 15 nm; or

2.	An overlay error less than 27 nm (mean + 3 sigma);’.