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Document 32019R2199R(02)

    Corrigendum to Commission Delegated Regulation (EU) 2019/2199 of 17 October 2019 amending Council Regulation (EC) No 428/2009 setting up a Community regime for the control of exports, transfer, brokering and transit of dual-use items (Official Journal of the European Union L 338, 30 December 2019)

    OJ L 72, 9.3.2020, p. 28–29 (BG, CS, DA, DE, ET, EL, EN, FR, HR, IT, LV, LT, HU, MT, NL, PL, PT, RO, SK, SL, FI, SV)
    OJ L 72, 9.3.2020, p. 30–31 (ES)

    ELI: http://data.europa.eu/eli/reg_del/2019/2199/corrigendum/2020-03-09/oj

    9.3.2020   

    EN

    Official Journal of the European Union

    L 72/28

    Corrigendum to Commission Delegated Regulation (EU) 2019/2199 of 17 October 2019 amending Council Regulation (EC) No 428/2009 setting up a Community regime for the control of exports, transfer, brokering and transit of dual-use items

    ( Official Journal of the European Union L 338, 30 December 2019 )

    On page 163, points 6A002.b to 6A002.f are replaced with the following:

    “b.

    “Monospectral imaging sensors” and “multispectral imaging sensors”, designed for remote sensing applications and having any of the following:

    1.

    An Instantaneous-Field-Of-View (IFOV) of less than 200 μrad (microradians); or

    2.

    Specified for operation in the wavelength range exceeding 400 nm but not exceeding 30 000 nm and having all the following;

    a.

    Providing output imaging data in digital format; and

    b.

    Having any of the following characteristics:

    1.

    “Space-qualified”; or

    2.

    Designed for airborne operation, using other than silicon detectors, and having an IFOV of less than 2,5 mrad (milliradians);

    Note:

    		 6A002.b.1. does not control "monospectral imaging sensors" with a peak response in the wavelength range exceeding 300 nm but not exceeding 900 nm and only incorporating any of the following non–"space-qualified" detectors or non–"space-qualified" "focal plane arrays":

    1.

    Charge Coupled Devices (CCD) not designed or modified to achieve 'charge multiplication'; or

    2.

    Complementary Metal Oxide Semiconductor (CMOS) devices not designed or modified to achieve 'charge multiplication'.

    c.

    'Direct view' imaging equipment incorporating any of the following:

    1.

    Image intensifier tubes specified in 6A002.a.2.a. or 6A002.a.2.b.;

    2.

    "Focal plane arrays" specified in 6A002.a.3.; or

    3.

    Solid state detectors specified in 6A002.a.1.;

    Technical Note:

    'Direct view' refers to imaging equipment that presents a visual image to a human observer without converting the image into an electronic signal for television display, and that cannot record or store the image photographically, electronically or by any other means.

    Note:

    		 6A002.c. does not control equipment as follows, when incorporating other than GaAs or GaInAs photocathodes:

    a.

    Industrial or civilian intrusion alarm, traffic or industrial movement control or counting systems;

    b.

    Medical equipment;

    c.

    Industrial equipment used for inspection, sorting or analysis of the properties of materials;

    d.

    Flame detectors for industrial furnaces;

    e.

    Equipment specially designed for laboratory use.

    d.

    Special support components for optical sensors, as follows:

    1.

    "Space-qualified" cryocoolers;

    2.

    Non-"space-qualified" cryocoolers having a cooling source temperature below 218 K (-55°C), as follows:

    a.

    Closed cycle type with a specified Mean-Time-To-Failure (MTTF) or Mean-Time-Between-Failures (MTBF), exceeding 2 500 hours;

    b.

    Joule-Thomson (JT) self-regulating minicoolers having bore (outside) diameters of less than 8 mm;

    3.

    Optical sensing fibres specially fabricated either compositionally or structurally, or modified by coating, to be acoustically, thermally, inertially, electromagnetically or nuclear radiation sensitive;

    Note:

    		 6A002.d.3. does not control encapsulated optical sensing fibres specially designed for bore hole sensing applications.

    e.

    Not used.

    f.

    'Read-out integrated circuits' ('ROIC') specially designed for "focal plane arrays" specified in 6A002.a.3.

    Note:

    		 6A002.f. does not control 'read-out integrated circuits' specially designed for civil automotive applications.

    Technical Note:

    A 'Read-Out Integrated Circuit' ('ROIC') is an integrated circuit designed to underlie or be bonded to a "focal plane array" ("FPA") and used to read-out (i.e., extract and register) signals produced by the detector elements. At a minimum the 'ROIC' reads the charge from the detector elements by extracting the charge and applying a multiplexing function in a manner that retains the relative spatial position and orientation information of the detector elements for processing inside or outside the 'ROIC'. ”

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